Ascentron provides state-of-the-art Surface Mount Technology (SMT) assembly and Plated Thru Hole (PTH) assembly and provides both leaded and lead-free processes.

We are committed to providing outstanding customer service and quality, and our highly qualified team of employees is focused on helping our customers succeed. All printed circuit board assemblies are built to IPC-A-610 Class II or III depending on customer requirements.

In the SMT area we employ multiple SMT lines, featuring Dek Horizon screen printers with internal Hawkeye inspection, state-of-the-art Panasonic pick & place machines placing up to 75,000 parts per hour, and Heller 10 zone air convection reflow ovens. Our SMT equipment will place the latest BGA (Ball Grid Array), Micro BGA, Land Grid Array (LGA), fine pitch leaded packages, and components down to 01005 size. We provide BGA Part on Part (PoP) assembly with one BGA placed on top of another BGA, place micro spring pins, and specialize in Flex Circuit assembly. For SMT inspection we utilize a Nordson DAGE 5-Axis X-Ray machine with 0.5 micron feature recognition, critical for PoP inspections. We also employ Koh Young Technology and Mirtek Automated Optical Inspection (AOI) equipment for accurate and efficient inspections.

We maintain a large number of SMT component feeders for our SMT lines, which allow us to have several jobs set up at a time for outstanding flexibility. Our equipment includes an advanced Feeder Exchange System (FES) for quick and efficient set-up and change-over of jobs.

In the PTH area we are fully equipped to handle all types of through-hole components. We have extensive PTH assembly experience and capabilities supported by an array of component prep, wave solder, selective solder, and PCBA cleaning equipment. We have both a dedicated RoHS line and a dedicated leaded solder line. Our factory has been supporting PTH assembly for many years.

For a list of our major equipment and links to additional details, click here.