Philips GEM Topaz-X Pick & Place Machines
(we have four of the Philips Topaz line of machines)
• 4 Flying Nozzle Change heads
• 4 Standard Change Heads
• Component Range: 0201 ~ SOP, SOJ, PLCC 32mm2, QFP 32mm2, BGA, uBGA, CSP
• Max. Component Size: 32mm2
• Max. Component Height: 6.5mm (placement side)
• CPH: 18,000 chips, 2,500 QPP
• Accuracy: 60micron @ 3 sigma
• Min. Lead Pitch: 0.4mm
• Max. Board Size: 460mm x 440mm (18.1" x 17.3")
• Min. Board Size: 50mm x 50mm (2.0" x 2.0")
• Board Thickness: 0.4mm ~ 4.0mm (0.015" ~ 0.15")
• PCB Positioning:
- Locate pins for tooling holes
- Edge clamping system
• Alignment system:
- Line sensor camera for vision on the fly
- Fore lighting illumination w/ 3 lighting angles
- Side illumination for BGA
• Leaded component recognition:
- Minimum lead pitch: 0.4mm
- Recognition of pitch, location, bent/missing, and cumulative pitch
• BGA ball recognition:
- Minimum ball pitch: 0.75mm
- Minimum ball size: 0.30mm
- Total BGA ball count, size, and pitch
• Fiducial Recognition:
- White light from 3 angles
- Inferred light from 2 angles
- Separate or combined panel, single image, and component fiducial recognition
- Common and programmable patterns
- Bad mark recognition
• Tape Feeder Positions: 80 (8mm)
• Bulk/Stick feeders
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